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           PMEG4002EB_2 ? NXP B.V. 2010. All rights reserved. Product data sheet Rev. 02 — 13 January 2010 5 of 8 NXP Semiconductors PMEG4002EB 0.2 A very low VF MEGA Schottky barrier rect ifier in SOD523 package 8. Package outline 9. Packing information [1] For further information and the availability of packing methods, see Section 13. 10. Soldering Fig 4. Package outline SOD523 (SC-79) 02-12-13 Dimensions in mm 1.65 1.25 1.55 1.15 0.17 0.11 0.34 0.26 0.65 0.58 0.85 0.75 1 2 Table 8. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number Package Description Packing quantity 3000 10000 PMEG4002EB SOD523 4 mm pitch, 8 mm tape and reel -115 -135 Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 5. Reflow soldering footprint SOD523 (SC-79) mgs343 1.80 1.90 0.30 0.40 0.50 0.60 1.20 2.15 solder lands solder resist occupied area solder paste |